DUBLIN, Sept. 26, 2023 /PRNewswire/ — The “The Global Market for Green and Sustainable Electronics Manufacturing 2024-2034” report has been added to ResearchAndMarkets.com’s offering.
The electronics industry has experienced significant growth in recent years, becoming an integral part of modern life. However, this growth has come at a cost to the environment, with issues like high energy consumption, resource depletion, and electronic waste (e-waste) becoming major concerns.
Waste electronics, in particular, has emerged as the fastest-growing and most hazardous waste stream globally, according to the United Nations. In response to these environmental challenges, there’s a growing need to make electronics manufacturing more sustainable and eco-friendly, leading to the concept of “green electronics.”
One of the areas where sustainability efforts are being concentrated is in the development of sustainable printed circuit board (PCB) designs. Traditional PCB manufacturing processes are known for their energy-intensive and environmentally harmful characteristics, involving materials like copper, epoxy resin, glass fiber, and water. Recycling these materials has proven to be inefficient and labor-intensive.
To address these issues, new materials are being employed in PCB manufacturing that are easily recyclable, including biodegradable polymers and paper-based PCBs. Environmentally friendly etchants are also being utilized in both subtractive and additive manufacturing processes, such as inkjet and laser printing. Additive methods, in particular, have shown significant promise, as they can reduce energy consumption during manufacturing by up to five times compared to conventional methods. Sustainable substrate materials made from various cellulose and wood-based materials, bioplastics, and biocomposites have been developed as well.
“The Global Market for Green and Sustainable Electronics Manufacturing 2024-2034” offers a comprehensive analysis of the global green electronics manufacturing industry. The report covers industry trends, drivers, challenges, approaches, technologies, materials, processes, and leading companies in segments like printed circuit boards (PCBs), integrated circuits (ICs), batteries, assembly, and the electronics supply chain. It provides market revenues and forecasts for sustainable PCBs and ICs, segmented by substrate and process types, up to 2034.
The report profiles 40 innovative companies that offer greener materials, chemistries, equipment, and manufacturing services to facilitate the transition toward more circular and lower-carbon electronics. It includes tables summarizing key manufacturers, processes, materials, and sustainability strategies in the field of green electronics.
The analysis in the report covers trends in renewables, additive manufacturing processes, biobased and recycled materials, toxicity reduction, supply chain transparency, e-waste recovery, and life cycle optimization to minimize the environmental footprint of electronics. It serves as a valuable resource for electronics OEMs, PCB and IC manufacturers, EMS companies, and suppliers looking to benchmark their sustainability efforts and identify new opportunities in the industry.
Key report contents include:
- An overview of green electronics manufacturing and the drivers for sustainability, including e-waste reduction, lower emissions, and resource efficiency.
- Analysis of environmental impacts such as carbon emissions, water usage, and waste generation.
- An exploration of regulations and certifications promoting sustainable electronics.
- Insights into powering electronics through renewable batteries.
- The use of bioplastics for injection-molded parts.
- A comparison of conventional vs. sustainable manufacturing approaches.
- Analysis of sustainability strategies, including renewable energy, materials efficiency, sustainable chemistry, recycled materials, and supply chain management.
- Information on sustainable PCB manufacturing, covering materials, substrates, patterning, and component attachment.
- Insights into sustainable integrated circuits manufacturing.
- Considerations for end-of-life electronics.
- Global PCB market size and forecasts from 2018 to 2034.
- Revenue forecasts for sustainable PCBs and ICs segmented by technology type.
- Profiles of 40 companies that provide green materials, equipment, and manufacturing services. These include companies like DP Patterning, Elephantech, Infineon Technologies, Jiva Materials, Samsung, Syenta, and Tactotek. Additional information is provided on bio-based battery, conductive ink, green and lead-free solder, and halogen-free FR4 companies.
Key Topics Covered:
2 GREEN ELECTRONICS MANUFACTURING
2.1 Conventional electronics manufacturing
2.2 Benefits of Green Electronics manufacturing
2.3 Challenges in adopting Green Electronics manufacturing
2.4.1 Closed-Loop Manufacturing
2.4.2 Digital manufacturing
2.4.3 Renewable Energy Usage
2.4.4 Energy Efficiency
2.4.5 Materials Efficiency
2.4.6 Sustainable Chemistry
2.4.7 Recycled Materials
2.4.8 Bio-Based and Non-Toxic Materials
2.5 Greening the Supply Chain
2.7 SUSTAINABLE PRINTED CIRCUIT BOARD (PCB) MANUFACTURING
2.7.1 Conventional PCB manufacturing
2.7.2 Trends in PCBs
18.104.22.168 High-Speed PCBs
22.214.171.124 Flexible PCBs
126.96.36.199 3D Printed PCBs
188.8.131.52 Sustainable PCBs
2.7.3 Reconciling sustainability with performance
2.7.4 Sustainable supply chains
2.7.5 Sustainability in PCB manufacturing
184.108.40.206 Sustainable cleaning of PCBs
2.7.6 Design of PCBs for sustainability
220.127.116.11 Additive manufacturing
18.104.22.168 In-mold electronics (IME)
22.214.171.124 Metal cores
126.96.36.199 Recycled laminates
188.8.131.52 Conductive inks
184.108.40.206 Green and lead-free solder
220.127.116.11 Biodegradable substrates
18.104.22.168 Biobased materials
22.214.171.124 Biobased inks
126.96.36.199 Halogen-free FR4
188.8.131.52.1 FR4 limitations
184.108.40.206.2 FR4 alternatives
220.127.116.11 Metal-core PCBs
18.104.22.168 Biobased PCBs
22.214.171.124 Paper-based PCBs
126.96.36.199 PCBs without solder mask
188.8.131.52 Thinner dielectrics
184.108.40.206 Recycled plastic substrates
220.127.116.11 Flexible substrates
2.7.9 Sustainable patterning and metallization in electronics manufacturing
18.104.22.168 Issues with sustainability
22.214.171.124 Regeneration and reuse of etching chemicals
126.96.36.199 Transition from Wet to Dry phase patterning
188.8.131.52.1 Direct Printed Electronics
184.108.40.206.2 Photonic Sintering
220.127.116.11.4 Plating Resist Alternative
18.104.22.168.5 Laser-Induced Forward Transfer
22.214.171.124.6 Electrohydrodynamic Printing
126.96.36.199.7 Conductive Adhesives
188.8.131.52.8 Green electroless plating
184.108.40.206.9 Smart Masking
220.127.116.11.10 Component Integration
18.104.22.168.11 Bio-inspired material deposition
22.214.171.124.12 Multi-material jetting
126.96.36.199.13 Vacuumless deposition
188.8.131.52.14 Upcycling waste streams
2.7.10 Sustainable attachment and integration of components
184.108.40.206 Conventional component attachment materials
220.127.116.11.1 Conductive adhesives
18.104.22.168.2 Biodegradable adhesives
22.214.171.124.4 Biobased solders
126.96.36.199.5 Bio-derived solders
188.8.131.52.6 Nano adhesives
184.108.40.206.7 Shape memory polymers
220.127.116.11.8 Photo-reversible polymers
18.104.22.168.9 Conductive biopolymers
22.214.171.124.1 Traditional thermal processing methods
126.96.36.199.2 Low temperature solder
188.8.131.52.3 Reflow soldering
184.108.40.206.4 Induction soldering
220.127.116.11.5 UV curing
18.104.22.168.6 Near-infrared (NIR) radiation curing
22.214.171.124.7 Photonic sintering/curing
126.96.36.199.8 Component embedding
188.8.131.52.9 Hybrid integration
2.7.11 End of life
184.108.40.206 Hazardous waste
220.127.116.11 Water Usage
18.104.22.168.1 Advanced recovery techniques
22.214.171.124 Green Certification
126.96.36.199 Life cycle assessment
2.8 Sustainable integrated circuits
2.8.1 IC manufacturing
2.8.2 Sustainable IC manufacturing
2.8.3 Wafer production
188.8.131.52 Limitations of existing production
184.108.40.206 Gallium nitride ICs
220.127.116.11 Flexible ICs
18.104.22.168 Fully printed organic ICs
2.8.4 Oxidation methods
22.214.171.124 Sustainable oxidation
126.96.36.199 Thin gate oxide layers
188.8.131.52 Metal oxides
2.8.5 Patterning and doping
184.108.40.206.1 Wet etching
220.127.116.11.1.1 Sustainability drawbacks
18.104.22.168.2 Dry plasma etching
22.214.171.124.3 Lift-off patterning
126.96.36.199.4 Surface doping
188.8.131.52.4.1 Sustainable approaches
184.108.40.206.1 Printed metal gates for organic thin film transistors
220.127.116.11 Physical vapour deposition
2.8.7 End of life
18.104.22.168 Renewable energy use
22.214.171.124 Water usage
3 GLOBAL MARKET AND REVENUES 2018-2034
3.1 Global PCB manufacturing industry
3.1.1 PCB revenues
3.2 Sustainable PCBs
3.3 Sustainable ICs
4 COMPANY PROFILES (42 company profiles)
5 RESEARCH METHODOLOGY
For more information about this report visit https://www.researchandmarkets.com/r/t9y8d9
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